Product Description
Silver-Plated Copper Wire (0.05mm Single Strand)
Product Overview
Silver-plated copper wire (0.05mm single strand) from Tankii Alloy Material is a high-performance ultra-fine conductor composed of high-purity oxygen-free copper (OFC) core and a uniform silver plating layer. Produced via precision drawing and continuous electroplating processes, this 0.05mm micro-wire delivers ultra-high electrical conductivity, excellent oxidation resistance, and superior corrosion resistance. With a diameter tolerance of ±0.002mm and plating thickness of 0.5–2.0μm, it is widely used in miniaturized electronic components, aerospace wiring, and high-frequency signal transmission applications.
Standard Designations & Core Material Foundation
- Base Material: High-purity oxygen-free copper (OFC, ≥99.99%)
- Plating Material: 99.9% pure silver
- Key Specification: 0.05mm single strand (diameter tolerance ±0.002mm)
- Plating Thickness: 0.5–2.0μm (customizable)
- Compliant Standards: ASTM B500, GB/T 4910, IEC 60884
- Manufacturer: Tankii Alloy Material, certified to ISO 9001 and IATF 16949, with advanced ultra-fine wire drawing and plating lines
Key Core Advantages (Centered on 0.05mm & Silver Plating)
1. Ultra-High Conductivity & Signal Transmission
- Enhanced Conductivity: Silver (σ=63×10⁶ S/m) has higher conductivity than copper, reducing signal loss in high-frequency applications. The 0.05mm diameter ensures minimal skin effect impact, making it ideal for high-speed data transmission in miniaturized devices.
- Low Contact Resistance: The silver plating provides a low-resistance surface, ensuring reliable electrical connections in connectors and switches, even after repeated mating cycles.
2. Excellent Oxidation & Corrosion Resistance
- Silver Protective Layer: The dense silver plating prevents copper oxidation at high temperatures or in humid environments, maintaining stable conductivity over time.
- Corrosion Resistance: Resists sulfurization and most chemical corrosion, suitable for harsh environments such as aerospace and industrial control systems.
3. Superior Mechanical Properties & Processability
- High Ductility: Despite its ultra-fine 0.05mm diameter, the wire maintains good ductility (elongation ≥15%), enabling bending and winding on extremely small mandrels (≥0.1mm) without breaking.
- Uniform Plating: Advanced electroplating technology ensures a uniform silver layer with no peeling or blistering, even after severe drawing and annealing processes.
Technical Specifications
| Attribute |
Value (Typical) |
| Base Material |
Oxygen-Free Copper (OFC) |
| Plating Material |
Pure Silver |
| Diameter |
0.05mm (±0.002mm) |
| Plating Thickness |
0.5–2.0μm |
| Tensile Strength |
350–450 MPa (Hard Drawn); 200–280 MPa (Annealed) |
| Elongation |
≥15% |
| Conductivity |
≥105% IACS (20°C) |
| Operating Temperature |
-60°C to +200°C |
| Surface Finish |
Bright silver, smooth, no oxidation |
Product Specifications
| Item |
Specification |
| Supply Form |
Spools (100m/500m/1000m per spool) |
| Plating Type |
Soft silver plating (for soldering) or hard silver plating (for wear resistance) |
| Packaging |
Vacuum-sealed bags + anti-static packaging + outer carton |
| Customization |
Diameter (0.02–0.1mm); plating thickness; pre-tinning |
Typical Application Scenarios
- Miniaturized Electronics: Used in fine-pitch connectors, bonding wires, and flexible circuits for smartphones, wearables, and medical devices.
- Aerospace & Defense: High-frequency signal wires, sensor leads, and lightweight wiring harnesses in aircraft and satellite systems.
- High-Frequency Communication: RF cables, antenna elements, and microwave components requiring low loss and high conductivity.
- Automotive Electronics: Sensor wires and high-speed data lines in advanced driver-assistance systems (ADAS).
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