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0.05mm Fine Wire Silver-Plated Copper Wire for Electrical Components

Short Description:


  • Product Name: Silver-Plated Copper Wire
  • Diameter: 0.05mm (±0.002mm)
  • Plating Thickness: 0.5–2.0μm
  • Tensile Strength: 350–450 MPa (Hard Drawn); 200–280 MPa (Annealed)
  • Elongation: ≥15%
  • Conductivity: ≥105% IACS (20°C)
  • Operating Temperature: -60°C to +200°C
  • Plating Material: Pure Silver
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    Product Description

    Silver-Plated Copper Wire (0.05mm Single Strand)

    Product Overview

    Silver-plated copper wire (0.05mm single strand) from Tankii Alloy Material is a high-performance ultra-fine conductor composed of high-purity oxygen-free copper (OFC) core and a uniform silver plating layer. Produced via precision drawing and continuous electroplating processes, this 0.05mm micro-wire delivers ultra-high electrical conductivity, excellent oxidation resistance, and superior corrosion resistance. With a diameter tolerance of ±0.002mm and plating thickness of 0.5–2.0μm, it is widely used in miniaturized electronic components, aerospace wiring, and high-frequency signal transmission applications.

    Standard Designations & Core Material Foundation

    • Base Material: High-purity oxygen-free copper (OFC, ≥99.99%)
    • Plating Material: 99.9% pure silver
    • Key Specification: 0.05mm single strand (diameter tolerance ±0.002mm)
    • Plating Thickness: 0.5–2.0μm (customizable)
    • Compliant Standards: ASTM B500, GB/T 4910, IEC 60884
    • Manufacturer: Tankii Alloy Material, certified to ISO 9001 and IATF 16949, with advanced ultra-fine wire drawing and plating lines

    Key Core Advantages (Centered on 0.05mm & Silver Plating)

    1. Ultra-High Conductivity & Signal Transmission

    • Enhanced Conductivity: Silver (σ=63×10⁶ S/m) has higher conductivity than copper, reducing signal loss in high-frequency applications. The 0.05mm diameter ensures minimal skin effect impact, making it ideal for high-speed data transmission in miniaturized devices.
    • Low Contact Resistance: The silver plating provides a low-resistance surface, ensuring reliable electrical connections in connectors and switches, even after repeated mating cycles.

    2. Excellent Oxidation & Corrosion Resistance

    • Silver Protective Layer: The dense silver plating prevents copper oxidation at high temperatures or in humid environments, maintaining stable conductivity over time.
    • Corrosion Resistance: Resists sulfurization and most chemical corrosion, suitable for harsh environments such as aerospace and industrial control systems.

    3. Superior Mechanical Properties & Processability

    • High Ductility: Despite its ultra-fine 0.05mm diameter, the wire maintains good ductility (elongation ≥15%), enabling bending and winding on extremely small mandrels (≥0.1mm) without breaking.
    • Uniform Plating: Advanced electroplating technology ensures a uniform silver layer with no peeling or blistering, even after severe drawing and annealing processes.

    Technical Specifications

    Attribute Value (Typical)
    Base Material Oxygen-Free Copper (OFC)
    Plating Material Pure Silver
    Diameter 0.05mm (±0.002mm)
    Plating Thickness 0.5–2.0μm
    Tensile Strength 350–450 MPa (Hard Drawn); 200–280 MPa (Annealed)
    Elongation ≥15%
    Conductivity ≥105% IACS (20°C)
    Operating Temperature -60°C to +200°C
    Surface Finish Bright silver, smooth, no oxidation

    Product Specifications

    Item Specification
    Supply Form Spools (100m/500m/1000m per spool)
    Plating Type Soft silver plating (for soldering) or hard silver plating (for wear resistance)
    Packaging Vacuum-sealed bags + anti-static packaging + outer carton
    Customization Diameter (0.02–0.1mm); plating thickness; pre-tinning

    Typical Application Scenarios

    • Miniaturized Electronics: Used in fine-pitch connectors, bonding wires, and flexible circuits for smartphones, wearables, and medical devices.
    • Aerospace & Defense: High-frequency signal wires, sensor leads, and lightweight wiring harnesses in aircraft and satellite systems.
    • High-Frequency Communication: RF cables, antenna elements, and microwave components requiring low loss and high conductivity.
    • Automotive Electronics: Sensor wires and high-speed data lines in advanced driver-assistance systems (ADAS).

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