CuMn7Sn Copper Manganese Tin Alloy Strip Used for Chip Resistors
CHEMICAL COMPOSITION
| Mn% | Sn% | Cu% | |
| Nominal Composition | 7 | 2.5 | Bal. |
PHYSICAL PROPERTIES
| Density g/cm3 | 8.5 |
| TCR 10-6/K | ±10 |
| Elastic Modulus GPa | 125 |
| Thermal Conductivity W/(m·K) | 35 |
| Thermal expansion coefficient 10-6/ K | 21.6 |
| EMF μV/K | -1 |
| Resistivity Ohm mm2/m | 0.29+/-0.04 |
MECHANICAL PROPERTIES
| State | Yield strength | Tensile strength | Elongation | Hardness |
| Mpa | MPa | % | HV | |
| R350 | - | 350 | 30 | 70 |
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