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Precision 4J42 Wire | Low Expansion Alloy for Vacuum Devices, Sensors, and Semiconductor Packages

Short Description:

4J45 alloy wire is a controlled thermal expansion Fe-Ni alloy consisting of approximately 45% nickel. It is engineered for applications requiring dimensional stability and hermetic sealing, particularly where thermal compatibility with glass or ceramic is crucial. This material is ideal for use in semiconductor lead frames, sensor housings, and high-reliability electronic packaging.


  • Coefficient of Thermal Expansion, 20–300°C: 7.5 × 10⁻⁶ /°C
  • Density: 8.2 g/cm³
  • Electrical Resistivity: 0.55 μΩ·m
  • Tensile Strength: ≥ 450 MPa
  • Magnetic Properties: Weakly magnetic
  • Diameter range: 0.02 mm – 3.0 mm
  • Product Detail

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    Product Overview

    4J42 wire is a precision-controlled expansion alloy composed of iron and approximately 42% nickel. It is engineered to closely match the thermal expansion of borosilicate glass and other packaging materials, making it an ideal choice for hermetic sealing, electronic packaging, and aerospace applications.


    Chemical Composition

    • Nickel (Ni): ~42%

    • Iron (Fe): Balance

    • Minor elements: Mn, Si, C (trace amounts)

    CTE (Coefficient of Thermal Expansion, 20–300°C): ~5.5–6.0 × 10⁻⁶ /°C
    Density: ~8.1 g/cm³
    Electrical Resistivity: ~0.75 μΩ·m
    Tensile Strength: ≥ 430 MPa
    Magnetic Properties: Soft magnetic, low coercivity


    Specifications

    • Diameter: 0.02 mm – 3.0 mm

    • Surface: Bright, oxide-free

    • Form: Spool, coil, cut-to-length

    • Condition: Annealed or cold drawn

    • Customization: Available on request


    Key Features

    • Matched thermal expansion for glass and ceramics

    • Stable mechanical and magnetic properties

    • Excellent vacuum compatibility

    • Ideal for electronic sealing, relays, and sensor leads

    • Low expansion with good ductility and weldability


    Applications

    • Glass-to-metal hermetic seals

    • Semiconductor lead frames

    • Electronic relay headers

    • Infrared and vacuum sensors

    • Communication devices and packaging

    • Aerospace connectors and enclosures


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