CuMn7Sn copper-manganese-tin alloy strip is engineered for chip resistor applications, offering a nominal composition of 7% manganese, 2.5% tin, and balance copper. With a resistivity of 0.29 ± 0.04 ohm·mm²/m and a TCR of ±10 × 10⁻⁶/K, it provides stable resistance performance for precision electronic components.
Featuring a density of 8.5 g/cm³, thermal conductivity of 35 W/(m·K), and an elastic modulus of 125 GPa, this alloy combines reliable electrical and thermal characteristics with practical mechanical strength. In the R350 condition, it offers a tensile strength of 350 MPa, 30% elongation, and a hardness of approximately HV70, making it suitable for efficient processing into high-performance resistor strips.
Featuring a density of 8.5 g/cm³, thermal conductivity of 35 W/(m·K), and an elastic modulus of 125 GPa, this alloy combines reliable electrical and thermal characteristics with practical mechanical strength. In the R350 condition, it offers a tensile strength of 350 MPa, 30% elongation, and a hardness of approximately HV70, making it suitable for efficient processing into high-performance resistor strips.
