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Dia 0.6mm Alloy M25 Copper Beryllium Wires for Contact Bridges

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Electrical Industry: Electrical Switch and Relay Blades, Fuse Clips, Switch Parts, Relay parts, Connectors, Spring Connectors, Contact Bridges, Belleville Washers, Navigational Instruments, Clips Fasteners: Washers, Fasteners, Lock Washers, Retaining Rings, Roll Pins, Screws, Bolts Industrial: Pumps, Springs, Electrochemical, Shafts, Non Sparking Safety Tools, Flexible Metal Hose, Housings for Instruments, Bearings, Bushings, Valve Seats, Valve Stems, Diaphragms, Springs, Welding Equipment, Rolling Mill Parts, Spline Shafts, Pump Parts, Valves, Bourdon Tubes, Wear Plates on Heavy Equipment, Bellows


  • Model NO.: C17200
  • wire diameter: 0.03mm Min.
  • Rod diameter: 3.0-300mm,
  • strip thickness: 0.05mm, Min
  • width thickness: 250mm,
  • HS Code: 74082900
  • Product Detail

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    Chemical Composition (Weight Percent) of C17200 Beryllium Copper Alloy:

    Delivering Solutions
    Alloy Beryllium Cobalt Nickel Co + Ni Co+Ni+Fe Copper
    C17200 1.80-2.00 - 0.20 Min 0.20 Min 0.60 Max Balance

    Remark: Copper plus additions equal 99.5% Min.
    Typical Physical Properties of C172:
    Density (g/cm3): 8.36
    Density before age hardening (g/cm3): 8.25
    Elastic Modulus (kg/mm2 (103)): 13.40
    Thermal Expansion Coefficient (20 °C to 200 °C m/m/°C): 17 x 10-6
    Thermal Conductivity (cal/(cm-s-°C)): 0.25
    Melting Range (°C): 870-980

    Common Temper we supply:

    CuBeryllium Designation ASTM Mechanical and Electrical Properties of Copper Beryllium Strip
    Designation Description Tensile Strength
    (Mpa)
    Yield Strength 0.2% offset  Elongation Percent HARDNESS 
    (HV)
    HARDNESS
    Rockwell
    B or C Scale
    Electrical Conductivity
    (% IACS)
    A TB00 Solution Annealed 410~530 190~380 35~60 <130 45~78HRB 15~19
    1/2 H TD02 Half Hard 580~690 510~660 12~30 180~220 88~96HRB 15~19
    H TD04 Hard 680~830 620~800 2~18 220~240 96~102HRB 15~19
    HM TM04 Mill hardened 930~1040 750~940 9~20 270~325 28~35HRC 17~28
    SHM TM05 1030~1110 860~970 9~18 295~350 31~37HRC 17~28
    XHM TM06 1060~1210 930~1180 4~15 300~360 32~38HRC 17~28

     

    Key Technology of Beryllium Copper(Heat treatment)

    Heat treatment is the most important process for this alloy system. While all copper alloys are hardenable by cold working, beryllium copper is unique in being hardenable by a simple low temperature thermal treatment. It involves two basic steps. The first is called solution annealing and the second, precipitation or age hardening.

    Solution Annealing

    For the typical alloy CuBe1.9 (1.8- 2%) the alloy is heated between 720°C and 860°C. At this point the contained beryllium is essentially “dissolved” in the copper matrix (alpha phase). By rapidly quenching to room temperature this solid solution structure is retained. The material at this stage is very soft and ductile and can be readily cold worked by drawing, forming rolling, or cold heading. The solution annealing operation is part of the process at the mill and is not typically used by the customer. Temperature, time at temperature, quench rate, grain size, and hardness are all very critical parameters and are tightly controlled by TANKII.

    Age Hardening

    Age hardening significantly enhances the material’s strength. This reaction is generally carried out at temperatures between 260°C and 540°C depending on alloy and desired characteristics. This cycle causes the dissolved beryllium to precipitate as a beryllium rich (gamma) phase in the matrix and at the grain boundaries. It is the formation of this precipitate which causes the large increase in material strength. The level of mechanical properties attained is determined by the temperature and time at temperature. It should be recognized that beryllium copper has no room temperature aging characteristics.

     


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