Chemical Content, %
| Ni | Mn | Si |
| Bal. | 1.5~2.5 | 0.1max |
| Resisivity at 20ºC | 11.5 microhm cm |
| Density | 8.81 g/cm3 |
| Thermal Conductivity at 100ºC | 41 Wm-1 ºC-1 |
| Linear Expansion Coefficient(20~100ºC) | 13×10-6/ ºC |
| Melting Point(Approx.) | 1435ºC/2615ºF |
| Tensile Strength | 390~930 N/mm2 |
| Elongation | Min 20% |
| Temperature Coefficient of Resistance(Km, 20~100ºC) | 4500 x 10-6 ºC |
| Specific Heat(20ºC) | 460 J Kg-1 ºC-1 |
| Yield Point | 160 N/mm2 |
Features
The company electrode material (conductive material) having a low resistivity, high temperature strength, the smaller the arc melting under the action of evaporation and so on.
The addition of Mn to pure Nickel brings much improved resistance to Sulphur attack at elevated temperatures and improves strength and hardness, without appreciable reduction of ductility.
Nickel 212 is used as a support wire in incandescent lamps and for electrical resistor terminations.
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